- 0.1-0.5 micron: mainly used for ultra-precision polishing, such as semiconductor chip manufacturing wafer polishing, can achieve atomic-level surface flatness, to ensure the performance and reliability of the chip; can also be used for ultra-precision polishing of optical lenses, including camera lenses, telescope lenses, etc., which can make the surface of the lens to achieve a very high degree of smoothness and cleanliness, reduce the scattering of light and refraction, improve the quality of optical imaging; in jewellery processing can be fine polishing of diamonds and other gemstones to show the bright luster of gems. In jewellery processing, it can be used for fine polishing of diamonds and other gemstones to show the bright luster of gemstones.
- 0.5-2 micron: It is suitable for the polishing of precision instrument parts, such as the parts of gyroscopes, accelerometers and other high-precision sensors in the field of aerospace, which can improve the surface quality, reduce friction and wear, and ensure the precision and stability of the instrument; it is also commonly used in the polishing of electronic components, such as hard disk heads, semiconductor packaging moulds, etc., which helps to improve the performance and service life of the electronic components. It helps to improve the performance and service life of electronic components.
- 2-5 micron: it can be used for grinding and polishing of ceramic materials, which can make the surface of ceramic smooth and improve the mechanical properties and appearance quality of ceramic; in the edge grinding of cemented carbide cutting tools, it can make the edge sharper and smoother, and improve the cutting performance and service life of the tools; it can be used in the fine engraving and polishing of jade and other handicrafts, which can achieve the delicate engraving effect and smooth surface texture. It can also be used for fine carving and polishing of jade and other handicrafts to achieve fine carving effect and smooth surface texture.
- 5-10 micron: commonly used in the grinding of optical glass, in the manufacture of optical components, it can quickly remove the residue on the glass surface, providing a good basis for the subsequent polishing process; in stone processing, it can be used for rough grinding and semi-finish grinding of marble, granite and other stone, to improve the processing efficiency of stone; in the grinding of metal materials, it can be used for roughing the metal surface, removing oxidised skin and burrs, etc. In the grinding process of metal materials, it can rough the surface of metal, remove oxidised skin and burr, etc.
- 10-20 micron: it is suitable for the manufacture of diamond drill bits in geological drilling field, the particle size of the micron powder can make the drill bits have strong cutting ability, and can quickly drill into the rock layer; it is also used in the diamond saw blades for cutting hard and brittle materials, such as marble, concrete, etc., which can improve the cutting efficiency and service life of the saw blades; it can be used in the rough grinding process for grinding hard and brittle materials, such as ceramics, glass, etc., to quickly remove the surface of the materials. It can also be used for rough grinding of hard and brittle materials such as ceramics, glass, etc. to quickly remove the residue on the surface of materials.
- Above 20 micron: mainly used in some occasions which require high processing efficiency and relatively low surface accuracy, such as stone barren cutting, which can quickly cut large stone into the required size and shape; in the processing of refractory materials, it can be used for roughing refractory bricks and other materials to improve processing efficiency; it can also be used for rough grinding and peeling of metal materials, to Quickly remove the impurities and oxidised layer on the metal surface.
