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World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology
With the rapid advancement of high-··· Mar,04,2026
The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads
In today's era of rapid technol··· Mar,02,2026
The Unavoidable Heat Dissipation Challenge in Virtual Reality Development
Thermal Interface MaterialsTo effec··· Feb,28,2026
Different preparation processes for diamond-coated copper cater to different requirements.
Preparation methods significantly i··· Feb,27,2026
Breaking Through Diamond Heat Dissipation Challenges: Core Temperature Reduced by 23°C, Technology Scalable for AI Chips and Other Fields
A university research team has deve··· Feb,26,2026
Diamond Copper: The “Heat Dissipation Engine” Ushering in a New Era of Computing Power
As the hardest substance in nature,··· Feb,25,2026
Spherical Alumina: The Hardcore Performer in Thermal Conductive Fillers
With the growing demand for high th··· Feb,24,2026
Diamond Fillers: The “Hard Currency” of Heat Dissipation
Currently, diamond is primarily inc··· Feb,06,2026
