Stable mass production of domestic diamond-copper composite sheets achieved, breaking the "thermal wall" bottleneck for high-power chip heat dissipation

Domestic PCBN cutting tool technology continues to achieve breakthroughs, supporting the green upgrading of high-end manufacturing through "hard turning instead of grinding"

CVD Diamond Heat Dissipation Materials Accelerate Industrialization, Breaking Thermal Management Bottlenecks for High-Power Chips

Domestic CVD heat sink achieves stable mass production, breaking the heat dissipation bottleneck of high-power chips

Domestic CVD Diamond Heat Sink Industrialization Accelerates, Breaking the Thermal Bottleneck of High-Power Chips

From Diamond Rings to Heat‑Dissipating Wafers: Henan’s Diamond Industry Opens a New Battlefield for Computing Power

Spherical Diamond: Technological Evolution and Application Landscape from Crystal Geometry to Functional Integration

Memorial Diamond: A Precious Stone Born from Memory