The successful fabrication of GaN-HEMTs on 2-inch polycrystalline diamond substrates will help increase the capacity of core telecommunications equipment and reduce power consumption.

Copper-diamond composite materials for heat dissipation in semiconductor devices

CVD Diamond Heat Sink Plates: A New Super-Conductive Material Designed for Heat Dissipation

Practical Applications of Polycrystalline Diamond

Diamond Heat Sink—CVD Heat Sink

In the Age of Computing Power, How Has Diamond Become the Ultimate Cooling Solution?

Diamond Heat Sinks: The King of Semiconductor Thermal Management!

Rapid Fabrication of 4-Inch “Self-Supporting” Ultra-Thin Diamond Films Achieved