Diamond has a thermal conductivity of up to 22 W/(m·K) at room temperature, which is 3 to 5 times that of copper, 6 times that of aluminum nitride, and more than 7 times that of aluminum oxide. It is capable of effectively dissipating heat generated by electronic devices. Diamond has a high electrical resistivity and is a typical insulator. Therefore, diamond is an ideal material for heat sinks.
Optical Communications: The emergence of large-area, high-thermal-conductivity CVD diamond films has made it possible to use them in thermal management applications for high-power laser diode arrays (LDAs) and other microelectronic and optoelectronic devices. The highest thermal conductivity level of diamond has reached 2200 W/(m·K).
Chip Cooling: Another highly promising application for diamond heat sinks lies in the developing field of multi-chip assembly technology. This technology aims to tightly arrange and integrate numerous VLSI chips in a three-dimensional configuration to create ultra-compact, ultra-high-performance devices. Effective heat dissipation from these chips is critical to this technology, and diamond films are the ideal material for addressing this technical challenge.
New Energy Vehicles: Diamond is a direct competitor to silicon carbide. Unlike silicon carbide, which has an upper temperature limit of 200°C (392°F), diamond can operate at temperatures exceeding 500°C. Many of the challenges faced in military aviation applications—such as high temperatures—are also relevant to the automotive industry, where reducing overall engine heat loss is essential.
5G Base Stations: Currently, the average power consumption of a single-tenant 5G outdoor base station is around 3.8 kW, more than three times that of a 4G base station. Electricity costs alone could potentially erode all of an operator’s profits. With the 5G market poised for rapid expansion, diamond—as a thermal management material for 5G base stations—will significantly reduce power consumption by fully leveraging its superior heat dissipation properties, thereby truly achieving green, eco-friendly, and low-carbon operations.
Military and Aerospace: The application of gallium nitride (GaN) in the aerospace sector is being rapidly explored, and the combination of GaN and diamond will enable a quantum leap in performance.
High-Power Automotive Electronic Devices: Diamond heat sinks can effectively solve heat dissipation issues and enhance the performance of power devices while maintaining the same dimensions. The size of diamond heat sinks is no longer limited to individual devices or small arrays; array sizes can be scaled up to several centimeters. They are widely used in various devices. When used in phased array chips, they can significantly improve system reliability while reducing system size and cost; when used in solid-state power amplifiers, they can significantly reduce device size, cost, and weight while improving efficiency; and when used in broadband communications, they can enhance reliability while reducing chip size and cost.
