The JCB MCD series of single crystal diamond wire drawing dies feature high hardness and excellent wear resistance. Our company uses (111)-oriented synthetic single crystal diamond as the die core, ensuring precise positioning and stable performance. Dies in this series produce wire with a high surface finish and are typically used for fine wire drawing applications requiring superior surface quality and very small diameters. They are primarily used for drawing tungsten wire, semiconductor bonding wire (gold wire, copper wire, and aluminum wire), medical wire, stainless steel wire, copper wire, cutting wire, special alloy wire, precious metal wire, and various other non-ferrous or ferrous metal wires.
- Our company uses (111)-oriented synthetic single crystal diamond as the die core, ensuring precise positioning and stable performance of the dies.
- Extremely high hardness and wear resistance guarantee a long service life for the dies.
- Single crystal diamond exhibits excellent thermal conductivity, making it suitable for high-temperature processing applications.
- The synthetic single crystal diamond ensures consistent quality and uniformity.
- The die hole surface has an extremely high finish, resulting in low friction.
- Size range: 0.0015mm–1.5mm (larger or smaller sizes can be customized according to customer requirements).
- Tungsten wire
- Semiconductor bonding wire (gold wire, copper wire, and aluminum wire)
- Medical wire
- Stainless steel wire
- Copper wire
- Cutting wire
- Special alloy wire
- Precious metal wire
- Various other non-ferrous or ferrous metal wires
Type | Thickness, MM |
MCD111 | 0.50-0.60 |
MCD111 | 0.60-0.70 |
MCD111 | 0.70-0.80 |
MCD111 | 0.80 |
MCD111 | 0.80-0.90 |
MCD111 | 0.90-1.00 |
MCD111 | 1.00 |
MCD111 | 1.10 |
MCD111 | 1.20 |
MCD111 | 1.20-1.30 |
MCD111 | 1.30 |
MCD111 | 1.30-1.40 |
MCD111 | 1.40 |
MCD111 | 1.40-1.50 |
MCD111 | 1.50-1.60 |
MCD111 | 1.60-1.80 |
MCD111 | 1.80-2.00 |