JCB MCD series single crystal diamond wire drawing die cores are characterized by high hardness and excellent wear resistance. Our company utilizes 111-oriented synthetic single crystal diamond as the core material, ensuring precise positioning and stable performance of the dies produced. The wires drawn using these dies exhibit high surface smoothness, making them suitable for applications requiring high surface quality and small diameter wire drawing. They are primarily used for drawing tungsten wires, semiconductor bonding wires (gold, copper, and aluminum wires), medical wires, stainless steel wires, copper wires, cutting wires, special alloy wires, precious metal wires, and various other colored or non-colored metal wires.
• Our company utilizes 111-oriented synthetic single crystal diamond as the die core, ensuring precise positioning and stable performance of the dies produced;
• Extremely high hardness and wear resistance ensure a long service life for the dies;
• Single crystal diamond possesses excellent heat dissipation properties, making it suitable for high-temperature processing;
• Single crystal diamond is artificially synthesized, ensuring consistent quality and uniformity;
• The surface smoothness of the die orifice is extremely high, resulting in minimal friction;
• Size range: 0.0015mm-1.5mm (larger or smaller sizes can be customized according to customer requirements).
• Tungsten wires
• Semiconductor bonding wires (gold, copper, and aluminum wires)
• Medical wires
• Stainless steel wires
• Copper wires
• Cutting wires
• Special alloy wires
• Precious metal wires
• Various other colored or non-colored metal wires
Type | Thickness, MM |
MCD111 | 0.50-0.60 |
MCD111 | 0.60-0.70 |
MCD111 | 0.70-0.80 |
MCD111 | 0.80 |
MCD111 | 0.80-0.90 |
MCD111 | 0.90-1.00 |
MCD111 | 1.00 |
MCD111 | 1.10 |
MCD111 | 1.20 |
MCD111 | 1.20-1.30 |
MCD111 | 1.30 |
MCD111 | 1.30-1.40 |
MCD111 | 1.40 |
MCD111 | 1.40-1.50 |
MCD111 | 1.50-1.60 |
MCD111 | 1.60-1.80 |
MCD111 | 1.80-2.00 |