The JADP series represents China's first agglomerated diamond powder, offering higher roughness compared to traditional single-crystal/polycrystalline diamond abrasives. It significantly reduces enterprise processing costs while delivering high rates, excellent roughness, and minimal scratching. The spherical particles are uniformly coated with diamond from the inside out, ensuring continuous grinding action; it boasts high utilization rates, fast cutting speeds, and consistent surface quality on processed workpieces. The particle size and strength can be customized according to customer requirements; with increased production capacity, it stands as the optimal choice for grinding materials. Currently, JCB has achieved comprehensive independent R&D and mass production of agglomerated diamond grinding powder, grinding fluid, and the accompanying grinding thinning pads.
Recommended Applications
Agglomerated Diamond Grinding Fluid: Used in conjunction with grinding discs for processing sapphire wafers, silicon carbide wafers, functional ceramics, and other brittle materials.
Agglomerated Diamond Grinding Pads: Used with cutting fluid for processing glass-ceramic covers, sapphire wafers, silicon carbide wafers, and other hard and brittle materials.
Primarily applied in semiconductor wafer processing, ceramic material processing, and metal material processing.
Ceramic Material Processing: Zirconia fingerprint recognition sheets, zirconia ceramic smartphone back covers, and other functional ceramics.
Product Features
1.Quasi-spherical morphology with a multi-edge microstructure; small cutting edges minimize deep scratches on processed workpieces.
2.Exhibits the isotropic properties of polycrystalline diamond, lacking a fixed cleavage plane, maintaining high grinding force during processing. The particles offer excellent wear resistance, achieving surface quality unattainable with other diamond abrasives.
3.Uniform internal and external structure of spherical particles ensures consistent self-sharpening and stable cutting performance.
4.Spherical particles are uniformly coated with diamond from the inside out, ensuring continuous grinding action.
Product Advantages
Offers a distinct advantage over traditional single-crystal/polycrystalline diamond abrasives: Extremely high sphericity agglomeration rate, delivering superior coarse/fine grinding performance.
High processing rate, minimal scratching, and excellent surface roughness.
Maximizes reduction in enterprise processing time, consumable costs, and labor expenses.
High processing rate, minimal scratching, and excellent surface roughness.
Particle size can be customized and developed according to customer requirements.
Increased production capacity year-on-year, making it the optimal choice for grinding materials currently available.
Particle Size Distribution and Application Scenarios
model | Original Particle Size Specifications | particle size distribution (μm) | Application Scenarios | |
D50 | Processing Targets | Preparation Methods | ||
JADP0508 | 0-0.5μm | 3-8μm | Intermediate Polishing of Chip Substrates | Grinding Fluid, Fine Polishing Wheels |
JADP1012 | 0-1μm | 8-12μm | Intermediate Polishing of Chip Substrates | Grinding Fluid, Fine Polishing Wheels |
JADP2025 | 1-2μm | 15-25μm | Fine Grinding of Chip Substrates | Grinding Fluid, Fine Polishing Wheels |
JADP3035 | 1-3μm | 25-35μm | Fine Grinding of Optical Wafers | Grinding Fluid, Grinding Paper |
JADP4040 | 2-4μm | 30-40μm | Grinding of Ceramic Devices | Grinding Fluid, Grinding Paper |
JADP6060 | 3-6μm | 40-60μm | Fine Grinding of Glass-Ceramics | Diamond Grinding Pads, Fine Polishing Wheels |
JADP7100 | 7μm | 70-100μm | Fine Grinding of Glass-Ceramics | Diamond Grinding Pads, Fine Polishing Wheels |