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Agglomerated Diamond Powder JADP Series
Agglomerated Diamond Powder JADP Series
Agglomerated Diamond Powder JADP Series
Agglomerated Diamond Powder JADP Series
Agglomerated Diamond Powder JADP Series
Agglomerated Diamond Powder JADP Series
Agglomerated Diamond Powder JADP Series

Agglomerated Diamond Powder JADP Series

The JADP series represents China's first agglomerated diamond powder, offering higher roughness compared to traditional single-crystal/polycrystalline diamond abrasives. It significantly reduces enterprise processing costs while delivering high rates, excellent roughness, and minimal scratching. The spherical particles are uniformly coated with diamond from the inside out, ensuring continuous grinding action;

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The JADP series represents China's first agglomerated diamond powder, offering higher roughness compared to traditional single-crystal/polycrystalline diamond abrasives. It significantly reduces enterprise processing costs while delivering high rates, excellent roughness, and minimal scratching. The spherical particles are uniformly coated with diamond from the inside out, ensuring continuous grinding action; it boasts high utilization rates, fast cutting speeds, and consistent surface quality on processed workpieces. The particle size and strength can be customized according to customer requirements; with increased production capacity, it stands as the optimal choice for grinding materials. Currently, JCB has achieved comprehensive independent R&D and mass production of agglomerated diamond grinding powder, grinding fluid, and the accompanying grinding thinning pads.

Recommended Applications

Agglomerated Diamond Grinding Fluid: Used in conjunction with grinding discs for processing sapphire wafers, silicon carbide wafers, functional ceramics, and other brittle materials.

Agglomerated Diamond Grinding Pads: Used with cutting fluid for processing glass-ceramic covers, sapphire wafers, silicon carbide wafers, and other hard and brittle materials.

Primarily applied in semiconductor wafer processing, ceramic material processing, and metal material processing.

Ceramic Material Processing: Zirconia fingerprint recognition sheets, zirconia ceramic smartphone back covers, and other functional ceramics.

Product Features

1.Quasi-spherical morphology with a multi-edge microstructure; small cutting edges minimize deep scratches on processed workpieces.

2.Exhibits the isotropic properties of polycrystalline diamond, lacking a fixed cleavage plane, maintaining high grinding force during processing. The particles offer excellent wear resistance, achieving surface quality unattainable with other diamond abrasives.

3.Uniform internal and external structure of spherical particles ensures consistent self-sharpening and stable cutting performance.

4.Spherical particles are uniformly coated with diamond from the inside out, ensuring continuous grinding action.

Product Advantages

Offers a distinct advantage over traditional single-crystal/polycrystalline diamond abrasives: Extremely high sphericity agglomeration rate, delivering superior coarse/fine grinding performance.

High processing rate, minimal scratching, and excellent surface roughness.

Maximizes reduction in enterprise processing time, consumable costs, and labor expenses.

High processing rate, minimal scratching, and excellent surface roughness.

Particle size can be customized and developed according to customer requirements.

Increased production capacity year-on-year, making it the optimal choice for grinding materials currently available.


Specification:

Particle Size Distribution and Application Scenarios


model



Original   Particle Size Specifications


particle size distribution (μm)


Application   Scenarios

D50


Processing   Targets


Preparation   Methods

JADP0508

0-0.5μm

3-8μm


Intermediate   Polishing of Chip Substrates


Grinding   Fluid, Fine Polishing Wheels

JADP1012

0-1μm

8-12μm

Intermediate Polishing of Chip Substrates



Grinding   Fluid, Fine Polishing Wheels

JADP2025

1-2μm

15-25μm


Fine Grinding of   Chip Substrates


Grinding   Fluid, Fine Polishing Wheels

JADP3035

1-3μm

25-35μm


Fine   Grinding of Optical Wafers


Grinding   Fluid, Grinding Paper

JADP4040

2-4μm

30-40μm


Grinding   of Ceramic Devices


Grinding   Fluid, Grinding Paper

JADP6060

3-6μm

40-60μm


Fine   Grinding of Glass-Ceramics


Diamond   Grinding Pads, Fine Polishing Wheels

JADP7100

7μm

70-100μm


Fine   Grinding of Glass-Ceramics


Diamond   Grinding Pads, Fine Polishing Wheels


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