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Diamond Heat Sinks: The King of Semiconductor Thermal Management!
2026-04-15
Diamond Heat Sinks: The King of Semiconductor Thermal Management!
As electronic products continue to evolve toward greater integration, ···
Rapid Fabrication of 4-Inch “Self-Supporting” Ultra-Thin Diamond Films Achieved
2026-04-07
Rapid Fabrication of 4-Inch “Self-Supporting” Ultra-Thin Diamond Films Achieved
Due to its excellent thermal conductivity and insulation properties, d···
Passive Thermal Management Materials
2026-03-05
Passive Thermal Management Materials
Passive cooling primarily employs thermal conduction or thermal radiat···
World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology
2026-03-04
World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology
With the rapid advancement of high-performance computing, high-power e···
The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads
2026-03-02
The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads
In today's era of rapid technological advancement, AI chips—the co···
The Unavoidable Heat Dissipation Challenge in Virtual Reality Development
2026-02-28
The Unavoidable Heat Dissipation Challenge in Virtual Reality Development
Thermal Interface MaterialsTo effectively conduct heat, thermal interf···
Different preparation processes for diamond-coated copper cater to different requirements.
2026-02-27
Different preparation processes for diamond-coated copper cater to different requirements.
Preparation methods significantly influence the thermophysical propert···
Breaking Through Diamond Heat Dissipation Challenges: Core Temperature Reduced by 23°C, Technology Scalable for AI Chips and Other Fields
2026-02-26
Breaking Through Diamond Heat Dissipation Challenges: Core Temperature Reduced by 23°C, Technology Scalable for AI Chips and Other Fields
A university research team has developed a scalable diamond heat dissi···
Diamond Copper: The “Heat Dissipation Engine” Ushering in a New Era of Computing Power
2026-02-25
Diamond Copper: The “Heat Dissipation Engine” Ushering in a New Era of Computing Power
As the hardest substance in nature, diamond also boasts exceptionally ···
Spherical Alumina: The Hardcore Performer in Thermal Conductive Fillers
2026-02-24
Spherical Alumina: The Hardcore Performer in Thermal Conductive Fillers
With the growing demand for high thermal conductivity materials, fille···
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