As the hardest substance in nature, diamond also boasts exceptionally high thermal conductivity, reaching up to 2300 W/(m·K). This property makes it highly promising for heat dissipation applications. Copper, a common metal, not only exhibits excellent electrical conductivity but also ranks among the top metals for thermal conductivity, with a coefficient of approximately 401 W/(m·K). It also offers outstanding machinability and good toughness. By combining diamond's high hardness, thermal conductivity, and low thermal expansion coefficient with copper's high electrical conductivity, thermal conductivity, and machinability, diamond-copper composite materials have emerged, offering a range of outstanding integrated properties.
01 In the Era of Computing Power Surge, Multiple Sectors Urgently Require High-End Thermal Solutions
We are now in an era where “computing power reigns supreme.” The heat generated by chips has long become a critical bottleneck limiting further performance improvements. From smartphones and laptops in our hands, to big data centers and 5G base stations supporting the digital economy, to aerospace and autonomous driving in high-end manufacturing—the advancement of nearly all high-tech devices relies on efficient thermal management technology. How to efficiently and rapidly dissipate the massive heat generated by chips has become a common challenge across the entire high-tech industry, driving an urgent demand for advanced thermal management materials.
Signals from industry giants have already made this clear. NVIDIA's experiments with diamond-based GPU cooling demonstrated a threefold increase in AI and cloud computing performance, a 60% reduction in temperature, and a 40% decrease in energy consumption. More significantly, NVIDIA has explicitly stated that its next-generation Vera Rubin architecture GPUs will fully adopt a novel solution combining “diamond-copper composite heat dissipation with 45°C warm water direct liquid cooling.” This signifies that diamond-copper composite heat dissipation is emerging as the key hope for overcoming thermal bottlenecks.
