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CVD Diamond Heat Sink Plates: A New Super-Conductive Material Designed for Heat Dissipation
2026-05-09
CVD Diamond Heat Sink Plates: A New Super-Conductive Material Designed for Heat Dissipation
Due to its extremely high thermal conductivity, and particularly the a···
Practical Applications of Polycrystalline Diamond
2026-05-08
Practical Applications of Polycrystalline Diamond
1. Diamond Heat Dissipation Applications in Advanced Packaging Technol···
Diamond Heat Sink—CVD Heat Sink
2026-05-07
Diamond Heat Sink—CVD Heat Sink
Since heat sink materials must be tightly mounted against the chip, tw···
In the Age of Computing Power, How Has Diamond Become the Ultimate Cooling Solution?
2026-04-30
In the Age of Computing Power, How Has Diamond Become the Ultimate Cooling Solution?
As the power consumption of NVIDIA’s next-generation GPUs surpasses 1,···
Diamond Heat Sinks: The King of Semiconductor Thermal Management!
2026-04-15
Diamond Heat Sinks: The King of Semiconductor Thermal Management!
As electronic products continue to evolve toward greater integration, ···
Rapid Fabrication of 4-Inch “Self-Supporting” Ultra-Thin Diamond Films Achieved
2026-04-07
Rapid Fabrication of 4-Inch “Self-Supporting” Ultra-Thin Diamond Films Achieved
Due to its excellent thermal conductivity and insulation properties, d···
Passive Thermal Management Materials
2026-03-05
Passive Thermal Management Materials
Passive cooling primarily employs thermal conduction or thermal radiat···
World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology
2026-03-04
World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology
With the rapid advancement of high-performance computing, high-power e···
The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads
2026-03-02
The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads
In today's era of rapid technological advancement, AI chips—the co···
The Unavoidable Heat Dissipation Challenge in Virtual Reality Development
2026-02-28
The Unavoidable Heat Dissipation Challenge in Virtual Reality Development
Thermal Interface MaterialsTo effectively conduct heat, thermal interf···
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