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Thermal conductive coated diamond (30~540μm)
Thermal conductive coated diamond (30~540μm)
Thermal conductive coated diamond (30~540μm)

Thermal conductive coated diamond (30~540μm)

Through innovative diamond coating technology, a coating of uniformly coated diamond with high thermal conductivity and good processing performance is formed. The coating can suppress thermal damage to...

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Thermal conductive coated diamond Diamond (including metal coatings and non-metal coatings on the diamond surface)(30~540μm)

Through innovative diamond coating technology, a coating with high thermal conductivity and good processing performance is formed uniformly coated diamond, the coating can suppress thermal damage to the diamond material, improve the thermal stability of the diamond, and enhance the wettability between diamond and metal substrates(such as aluminum, copper, etc.), there by enhancing the interfacial bonding strength, reducing interfacial thermal resistance, and improving the thermal conductivity of the material.

Application: Suitable for high-end thermal interface materials (TIMs) in electronics, optical electronics, and high-power devices, where efficient heat dissipation is critical.

Thermal conductive diamond powder is widely used across industries to enhance heat dissipation and improve the reliability of thermal management solutions. Its excellent thermal conductivity, electrical insulation, and compatibility with diverse materials make it an ideal choice for electronic packaging, composites, and advanced thermal interface materials.

  1. Thermal Interface Materials (TIMs): Used as a high-performance filler in thermal grease, pads, and adhesives to enhance heat transfer and maintain electrical insulation in electronic devices and power modules.

  2. Electronic Packaging: Improves thermal conductivity of encapsulants, underfills, and potting compounds, helping dissipate heat from semiconductors and extend component lifespan.

  3. Polymer and Resin Composites: Blended into plastics, epoxies, and composites to create lightweight materials with excellent thermal conductivity for housings, connectors, and heat spreaders.

  4. Ceramic and Metal Matrix Composites: Incorporated into ceramic or metal matrices to form high-thermal-conductivity structural parts used in aerospace, automotive, and high-power electronics.

  5. Advanced Thermal Management Systems: Applied in customised solutions for high-reliability thermal management applications, such as LED cooling, communication equipment, and energy storage systems.

With high purity, uniform particle morphology, and excellent compatibility with diverse matrix materials, JCB’s thermal conductive diamond powder helps manufacturers create efficient, reliable thermal management solutions across a wide range of industries.

It can be applied to precision grinding and polishing pads, high-power resin bond grinding wheels/cutting discs, CVD diamond growth substrates, diamond electroplated tools, and diamond sintered tools.

JCB diamond can provide various metal coatings,non-metal coatings and alloy coatings, including: titanium(Ti), chromium (Cr), copper (Cu), aluminum (Al), molybdenum (Mo), zirconium (Zr), tungsten (W), cobalt (Co), silicon (Si), copper-tin alloy (CuSn), copper-chromium alloy (CuCr), etc.


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