Products Description
Engineered for extreme thermal management — CVD diamond substrate delivers unmatched heat conductivity up to 2200 W/m·K.
As the hardest known natural substance, diamond features a wide bandgap, broad optical transparency range, minimal compressibility, and the highest thermal conductivity at room temperature. It also exhibits excellent chemical inertness toward most substances, making it ideal for use in extreme conditions such as high temperature, high pressure, and high frequency.
In terms of thermal properties, diamond is the most thermally conductive material found in nature, with a thermal conductivity of 2000–2200 W/m·K at room temperature—about four times higher than silicon carbide (SiC), thirteen times higher than silicon (Si), forty-three times higher than gallium arsenide (GaAs), and four to five times higher than copper or silver.
Modern high-power electronic and optoelectronic devices—such as those used in 5G applications, high-speed computing, and high-power semiconductor chips—generate intense heat within a very small area, creating serious cooling challenges. To achieve rapid heat dissipation, highly thermally conductive materials are required for heat sinks and coatings at the heat-generating ends (such as radiators, fans, or thermal substrates).
With its exceptionally high thermal conductivity across a wide temperature range, extremely low thermal expansion coefficient, and electrical insulation at room temperature, diamond has become the optimal choice for advanced thermal management solutions.
Figure (a) Sapphire substrate without dielectric. (b) Diamond substrate without dielectric. (c) Diamond substrates with PMMA interlayer.
