Characteristic: Micron- and nano-scale thermal conductive diamond powder with narrow particle size, good morphology, and high purity. Few internal defects and excellent thermal conductivity, dispersing evenly in various matrices as a functional filler.
This is a diamond powder with very small particles (micron or nano size). It has a tight particle size range, good shape, and very high purity. There are very few defects inside, and it conducts heat extremely well.
It can be used as a special filler, mixed evenly into different materials. It is also used to make thermal products like thermal grease, thermal glue, and thermal pads.
Size： 50nm~50µm
Main Advantages
1.Extremely High Thermal Conductivity: This is its most important feature. The carbon atoms in diamond are locked together tightly. Heat moves through them very easily and quickly, much better than through metals or other non-metal materials.
2.High Electrical Insulation: Pure diamond does not conduct electricity. This is very useful in electronics (for example, between a chip and its base) where you need to remove heat without causing a short circuit.
3.Very High Hardness and Wear Resistance: It is the hardest material known (Mohs hardness 10). When added to other materials, it makes them much more resistant to wear.
4.Low Thermal Expansion: It does not expand or shrink much with temperature changes. It works well with materials like silicon, reducing damage from heat stress.
5. Good Chemical Stability: It is not easily damaged by acids or alkalis, so its performance stays stable for a long time.
Application: Suitable for high-end thermal interface materials (TIMs) in electronics, optical electronics, and high-power devices, where efficient heat dissipation is critical.
Thermal conductive diamond powder is widely used across industries to enhance heat dissipation and improve the reliability of thermal management solutions. Its excellent thermal conductivity, electrical insulation, and compatibility with diverse materials make it an ideal choice for electronic packaging, composites, and advanced thermal interface materials.
Thermal Interface Materials (TIMs): Used as a high-performance filler in thermal grease, pads, and adhesives to enhance heat transfer and maintain electrical insulation in electronic devices and power modules.
Electronic Packaging: Improves thermal conductivity of encapsulants, underfills, and potting compounds, helping dissipate heat from semiconductors and extend component lifespan.
Polymer and Resin Composites: Blended into plastics, epoxies, and composites to create lightweight materials with excellent thermal conductivity for housings, connectors, and heat spreaders.
Ceramic and Metal Matrix Composites: Incorporated into ceramic or metal matrices to form high-thermal-conductivity structural parts used in aerospace, automotive, and high-power electronics.
Advanced Thermal Management Systems: Applied in customised solutions for high-reliability thermal management applications, such as LED cooling, communication equipment, and energy storage systems.
With high purity, uniform particle morphology, and excellent compatibility with diverse matrix materials, JCB’s thermal conductive diamond powder helps manufacturers create efficient, reliable thermal management solutions across a wide range of industries.
