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High Thermal Conductivity Diamond Micron Powder JCB-30(50nm~50um)
High Thermal Conductivity Diamond Micron Powder JCB-30(50nm~50um)
High Thermal Conductivity Diamond Micron Powder JCB-30(50nm~50um)

High Thermal Conductivity Diamond Micron Powder JCB-30(50nm~50um)

This is a diamond powder with very small particles (micron or nano size). It has a tight particle size range, good shape, and very high purity. There are very few defects inside, and it conducts heat extremely well.It can be used as a special filler, mixed evenly into different materials. It is also used to make thermal products like thermal grease, thermal glue, and thermal pads.

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This is a diamond powder with very small particles (micron or nano size). It has a tight particle size range, good shape, and very high purity. There are very few defects inside, and it conducts heat extremely well.

It can be used as a special filler, mixed evenly into different materials. It is also used to make thermal products like thermal grease, thermal glue, and thermal pads.

 

Main Advantages

1.Extremely High Thermal Conductivity: This is its most important feature. The carbon atoms in diamond are locked together tightly. Heat moves through them very easily and quickly, much better than through metals or other non-metal materials.

2.High Electrical Insulation: Pure diamond does not conduct electricity. This is very useful in electronics (for example, between a chip and its base) where you need to remove heat without causing a short circuit.

3.Very High Hardness and Wear Resistance: It is the hardest material known (Mohs hardness 10). When added to other materials, it makes them much more resistant to wear.

4.Low Thermal Expansion: It does not expand or shrink much with temperature changes. It works well with materials like silicon, reducing damage from heat stress.

5. Good Chemical Stability: It is not easily damaged by acids or alkalis, so its performance stays stable for a long time.


Specification:

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