Product Overview
MCD drawing dies use natural or HPHT synthetic single crystal diamond as the core material. The single crystal diamond‘s grain‑boundary‑free, complete crystalline structure provides extremely high wear resistance and excellent internal surface finish when drawing fine and precision wires. Compared with polycrystalline diamond (PCD) drawing dies, MCD cores can be polished to a smoother bore surface, significantly reducing drawing friction, extending die life, and improving the surface quality of the finished wire.
Especially suitable for drawing: Tungsten wire, molybdenum wire, copper wire, gold wire, silver wire, platinum‑group precious metal wires, stainless steel micro‑wire, copper‑coated welding wire, and other high‑precision, high‑surface‑quality wires.
Specification：
Application Fields
| Industry | Typical Wire Types | Wire Diameter Range |
|---|
| EDM electrode wire | Molybdenum, tungsten, copper | φ0.02 – 0.35 mm |
| Electronic packaging bonding wire | Gold, silver, copper bonding wire | φ0.015 – 0.075 mm |
| Medical guidewire | Stainless steel micro‑wire, Nitinol | φ0.05 – 0.50 mm |
| Precision spring wire | Music wire, oil‑tempered steel wire | φ0.10 – 1.50 mm |
| Welding wire | Copper‑coated wire, flux‑cored wire | φ0.60 – 3.00 mm |
| Precious metal wire | Platinum, gold, silver | φ0.02 – 0.50 mm |
Technical Specifications (Reference)
| Parameter | Range |
|---|
| Die Core Material | Single crystal diamond (natural / HPHT synthetic) |
| Core Crystal Orientation | (100) or (110) optional |
| Bore Diameter Range | 0.010 mm – 2.00 mm |
| Bore Diameter Tolerance | ±0.0005 mm (tighter tolerances available on request) |
| Ovality | ≤ 0.0005 mm |
| Surface Roughness (Ra) | ≤ 0.01 μm (mirror polish inside bore) |
| Casing Material | Stainless steel / Titanium alloy / Cemented carbide |
| Operating Temperature | ≤ 600 ℃ (higher under inert atmosphere) |
Note: Non‑standard sizes and special entry/exit angles can be customized.
