The CVD polycrystalline diamond heat sink sheet produced by our company is an ideal material for electronic cooling devices. At room temperature, the thermal conductivity of CVD polycrystalline diamond is five times that of copper, which can meet a variety of thermal applications and is widely used in the production of laser diodes, laser diode arrays, high-power semiconductor devices, microwave devices and large scale integrated circuit heat sinks. CVD polycrystalline diamond heat sink sheet produced by our company, its thermal conductivity can reach 1000~2000W/K.m, can be single-sided, double-sided polishing and other processing.
| CVD | AI | Cu | Au | SiC | Graphite /Cu | W | |
| Electrical property | insulator | conductor | conductor | conductor | insulator | conductor | conductor |
| Thermal conductivity /(W/(cm.K)) | 2000 | 247 | 398 | 315 | 270 | 400 | 155 |
| Coefficient of thermal expansion /(10-6K-1) | 0.8-1.0 | 23 | 17 | 14 | 3.7 | 2.8-3.5 | 4.5 |
| Density /(g/cm3) | 3.52 | 2.70 | 8.90 | 19.32 | 3.30 | 5.30 | 19.30 |
| item | argument |
| Vickers hardness | 8000~10000 kg/mm² |
| Thermal conductivity | 1000~2000 W/m.K(300K) |
| density | 3.51 g/cm after |
| Young's modulus | 1000~1100GPa |
| Electrical resistivity | > 1010Ωcm (before underside polishing) |
| > 106Ω cm (growing surface) | |
| Coefficient of thermal expansion | 2.3 x10-6 & have spent 1 ℃ - |
| Cutting tolerance | 0.030 mm or less |
Note: Single side or double side polishing, shape and size can be cut according to customer requirements.
