Detail
The main purpose of etching diamond is to change its surface morphology and increasethe specificsurface area, thereby improving the interface contact area between diamond and metal matrixmaterials.This helps with heat transfer at the interface, reducing the thermal resistance at the interface, thus improvingthe overall thermal conductivity of diamondcomposites.
Characteristic: Etched thermal conductive diamond features a modified surface with improved morphology and bonding. It maintains ultra-high thermal conductivity, reduces surface defects, and enhances adhesion — achieving lower interfacial resistance and better heat transfer.
Application：Used in high-power electronics, 5G devices, LEDs, and advanced thermal interface materials (TIMs), as well as in metal matrix composites and microchannel coolers, where efficient and reliable heat dissipation is essential.
Size： 30µm~540µm
Application: Suitable for high-end thermal interface materials (TIMs) in electronics, optical electronics, and high-power devices, where efficient heat dissipation is critical.
Thermal conductive diamond powder is widely used across industries to enhance heat dissipation and improve the reliability of thermal management solutions. Its excellent thermal conductivity, electrical insulation, and compatibility with diverse materials make it an ideal choice for electronic packaging, composites, and advanced thermal interface materials.
Thermal Interface Materials (TIMs): Used as a high-performance filler in thermal grease, pads, and adhesives to enhance heat transfer and maintain electrical insulation in electronic devices and power modules.
Electronic Packaging: Improves thermal conductivity of encapsulants, underfills, and potting compounds, helping dissipate heat from semiconductors and extend component lifespan.
Polymer and Resin Composites: Blended into plastics, epoxies, and composites to create lightweight materials with excellent thermal conductivity for housings, connectors, and heat spreaders.
Ceramic and Metal Matrix Composites: Incorporated into ceramic or metal matrices to form high-thermal-conductivity structural parts used in aerospace, automotive, and high-power electronics.
Advanced Thermal Management Systems: Applied in customised solutions for high-reliability thermal management applications, such as LED cooling, communication equipment, and energy storage systems.
With high purity, uniform particle morphology, and excellent compatibility with diverse matrix materials, JCB’s thermal conductive diamond powder helps manufacturers create efficient, reliable thermal management solutions across a wide range of industries.
