Wire conductor
Diamond wire drawing die can draw a variety of wire wires from millimeter to micron in diameter for the electronics industry. The drawing product has good roughness and high precision, and the accuracy can reach 1-2μm. Especially for high-hardness metal wires, such as micrometer platinum wire, tungsten wire, and ultra-fine copper wire, diamond wire drawing die is the ideal tool. Diamond wire drawing die can withstand high pressure, friction and several hundred degrees of high temperature, not easy to wear deformation, service life of several years, even decades, durability is dozens of times to hundreds of times carbide wire drawing die. Compared with natural diamond wire drawing die, polycrystalline diamond wire drawing die has more unique features. It does not have the anisotropy of natural diamond, it is not easy to split, and it will not cause deformation because of rapid wear in a particular direction, and the drawing hole can always remain positive and circular. Another feature of polycrystalline diamond wire drawing die is that there is a relatively low hardness bonding layer between diamond particles, and its thickness is several microns to tens of microns. In this way, in the use of the hole wall will form a fine groove, can accommodate the lubricant, therefore, although the hardness of polycrystalline diamond is lower than natural diamond, but the life is longer than the latter, a good polycrystalline diamond wire drawing die life is several times that of natural diamond wire drawing die. The polycrystalline diamond wire drawing die is cheap, only 1/3 to 1/5 of the natural diamond wire drawing die.
Solar photovoltaic
Our wafer cutting solutions: silicon wafer cutting is a key part of the solar photovoltaic cell manufacturing process, our metal binder wire saw powder, resin binder diamond wire saw powder and related coating products can help customers solve this problem, and the use of good results, by the customer praise! The professional solutions we provide can meet the processing requirements of high efficiency wafer cutting efficiency and long life, good cutting surface quality, less surface cutting scratches, and the combination of multi-size abrasive particles and various binders to meet different processing needs.
Our diamond solutions for silicon wafer thinning and grinding: We offer our ceramic bond and resin bond diamond series according to our customers' different processing and end application requirements, and provide customized products according to strength and crystal type. The silicon wafer processing process is generally divided into rough grinding and fine grinding, rough grinding, the diamond on the grinding wheel is coarse, fine grinding, with fine diamond, in which the ceramic bond is mainly used for rough grinding processing, resin bond for semi-fine grinding processing, customers can choose different diamond bond abrasive according to the processing requirements.
Magnetic material
We offer a high quality diamond range of metal and resin binders that are successful in grinding hard and soft magnetic oxygen, whether cutting, grooving, forming, flat grinding, double face grinding, vertical grinding or coreless grinding. Can be used in ferrite, iron cobalt nickel alloy, aluminum nickel cobalt, Ndfeb, and other soft and hard magnetic materials. The product has the characteristics of good sharpness, good durability, good heat resistance, very suitable for a variety of dry grinding, wet grinding environment. It is the right choice for your magnetic material grinding.
Semiconductor industry applications
The electronic information industry is the leader of the development of the national economy, and the integrated circuit is the core and foundation of the electronic information industry, which has important strategic significance for the economic development of the country.
At present, more than 95% of semiconductor devices and more than 99% of integrated circuits are made of silicon materials. In order to meet the requirements of chip miniaturization, high density, high digitalization and system integration, higher requirements are put forward for chip diameter, flat line width and metal interconnect layer number, which also puts higher requirements on chip precision processing. Our metal-bonded diamond and resin-bonded diamond and related coating products provide a complete chain of precise customization services.
First, we provide special micro powder for diamond grinding wheel for silicon wafer processing
In the manufacturing process of silicon-based semiconductor devices, diamond grinding wheels have two main uses:
On the one hand, it can be used for the fine grinding of etched silicon wafers, which aims to improve the flatness of silicon wafers in the silicon library delivered to the polishing process and reduce the amount of silicon wafers removed in the polishing process.
Another use is to reduce the overall thickness of the silicon wafer before the slicing process. With the growing demand in markets such as smart cards and smart labels, there is also a growing demand for thin, bendable silicon wafers, thus requiring more backside grinding processes.
Second, we provide silicon square, cut, cut silicon core with diamond line saw custom powder
Diamond wire cutting can improve the production capacity of silicon square and truncation, and is a suitable alternative to traditional mortar cutting.
Product advantages:
1. Cutting speed is fast, cutting speed is - times that of mortar cutting.
2.Clean and efficient production.
3. Lower consumption compared with traditional mortar cutting, and lower consumption of electricity and water in the production process.
4. Stable quality and good reproducibility.
5. Good cutting accuracy, good cutting surface quality.
6. Less surface line marks.
Third, we provide special diamond powder for wafer chamfering and round edge grinding wheels
The outer edge of the wafer cut by wire cutting or internal cutting saw blade is very sharp. In order to avoid the influence of edge cracking on the wafer strength, damage to the surface finish and pollution to the later process, special CNC equipment must be used to automatically trim the edge edge, shape and outer diameter of the wafer.
Surface grinding wheel for silicon cast blocks for solar cells, surface grinding wheel for resin and metal bond forms, suitable for high efficiency processing of silicon cast blocks
Fourth, we provide special diamond powder for wafer back reducing grinding wheel
Wafer back thinning grinding with diamond grinding wheel back cutting thin grinding, coarse grinding and fine grinding. Coarse grinding, the diamond of the grinding wheel is coarse, this kind of grinding wheel includes ceramic bond and resin bond two categories, mainly used for integrated circuit, discrete device manufacturing process of wafer back or front wafer thinning grinding processing, in which ceramic bond is mainly used for coarse grinding processing, resin bond for semi-static grinding, fine grinding.
5. We provide special diamond powder for wafer scribing knives
Our resin binder and metal binder diamond micropowder can meet the precision cutting requirements of the front and back end slicing processes, and the uniform dispersion technology of ultra-fine powder abrasive can carry out difficult chamfer cutting and step cutting processing, which reflects the excellent performance of high toughness, high precision, ultra-thin, long life and easy to use in customer applications.
Our JMD synthetic diamond fine material, diamond crushing material, diamond powder, diamond wire drawing die are widely used in electronic and electrical industry and other fields.
