In recent years, China's new materials, semiconductor, photovoltaic and other industries are booming, making photovoltaic silicon materials, sapphire, magnetic materials, semiconductors, ceramics, glass and many other hard and brittle materials for the “cutting, grinding, grinding, grinding, casting,” and other precision process requirements are also increased. Diamond grinding wheel as the “teeth of industry”, is the use of bonding agent will be coarse particles of diamond particles bonded together, the formation of a solid round object (most of the round, the center of the hole), can be in the outer edge of the surface of the myriad of hard, sharp, temperature-resistant small abrasive grains continuously on the surface of a variety of materials to do the cutting and grinding work, and therefore in the present-day Therefore, it has a significant position in today's industrial production.
In order to solidify the hard abrasive particles into a certain shape, so that it has a certain grinding ability, the existence of the “binding agent” is essential. Currently used in diamond grinding tools in the bond material can be divided into resin, metal and ceramic three, of which the resin binder heat-resistant performance is poor, the grinding process generated by the grinding heat is easy to soften the resin, resulting in a decline in the adhesion of the abrasive, wheel durability is poor. Although the metal bond diamond grinding wheel has high bond strength, good abrasion resistance, low wear, long service life, low grinding cost, and can withstand large loads, it has poor self-sharpening and is easy to be clogged.
Ceramic bond diamond grinding wheels use silicate, kaolin, feldspar, quartz (also known as silicon oxide, SiO2) and molten bond to sinter at temperatures above 800°C, thus forming a structure in which diamond particles are surrounded by the bond. Due to the high sintering temperature, a reaction may occur between the particles and the bonding agent, leaving air holes in the bridge between the bonding agent. Therefore, compared to diamond grinding wheels with resin and metal as the bonding agent, ceramic bond diamond grinding wheels have a remarkable amount of air holes, which is conducive to chip evacuation and heat dissipation, and is less likely to clog and burn the workpiece.
In addition, the inherent characteristics of ceramic materials make the ceramic bond diamond grinding wheels have high strength, good heat resistance, good shape retention of the grinding wheel, high precision of the ground workpiece, and the self-sharpening of the grinding wheel is strong, easy to dress, so it is widely used in cemented carbide, special ceramics, glass, non-metallic hard and brittle materials, magnetic materials, friction materials, diamond and CBN composites, and other hard and brittle materials, grinding and precision grinding, especially in Sintered carbide and Sintered ceramics. and precision grinding, especially in SiC and other semiconductor substrate finishing, the grinding force is small, the workpiece is not easy to damage, the processing yield is high, with high speed, high efficiency, high precision, low grinding cost and environmental pollution
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