1. Grinding and Polishing (The Core and Most Traditional Application)
This is the area with the largest consumption of diamond micropowder, primarily used for processing hard and brittle materials.
Precision Grinding and Polishing:
Optical Glass: High-precision polishing of camera lenses, microscopes, telescopes, laser optical components, etc.
Semiconductor Materials: Thinning and polishing of silicon wafers, silicon carbide (SiC), and GaN on sapphire substrates.
Gemstone Processing: Cutting and polishing of high-end gemstones such as diamond, ruby, and sapphire.
Bonded Abrasives:
Diamond Grinding Wheels: For grinding superhard materials such as carbide (tungsten steel), ceramics, glass, and stone.
Diamond Grinding Points/Files: For fine shaping and polishing in molds, jewelry, dentistry, and other fields.
Coated Abrasives:
Diamond Abrasive Belts/Sandpaper: For free-form grinding, such as polishing granite and marble slabs and grinding carbide tools.
2. Precision Cutting (Slicing)
Ultra-precision cutting is performed using electroplated or sintered blades made of diamond micropowder and a metal binder.
Semiconductor Dicing: Dividing wafers into individual dies after the chips are fabricated is a critical post-process in semiconductor manufacturing.
Ceramic Substrate Cutting: Cutting ceramic circuit boards in the electronics industry.
Gemstone Cutting: Diamond saw blades are essential for cutting rough diamonds, especially rough diamonds.
3. Drilling and Exploration
Petroleum/Geological Drill Bits: In oil and gas drilling and geological exploration, diamond drill bits (PDC drill bits) are core tools for breaking hard rock formations, significantly improving drilling efficiency and service life.
Engineering Thin-Wall Drilling: Drilling holes in reinforced concrete, asphalt, and refractory materials during construction, such as coring and pipe openings.
