1. Diamond Heat Dissipation Applications in Advanced Packaging Technologies:
The School of Electronic Science and Technology at Xiamen University, in collaboration with teams including Huawei, has successfully integrated a polycrystalline diamond substrate onto the back of a 2.5D glass interposer packaging chip. This technology leverages diamond’s ultra-high thermal conductivity. When the power density at the chip’s hotspots is approximately 2 W/mm², it can reduce the maximum junction temperature by 24.1°C and lower the packaging thermal resistance by 28.5%. This breakthrough demonstrates that diamond-substrate-based advanced packaging for integrated chip cooling holds significant application potential.
2. Applications of Diamond Heat Sinks in Semiconductor Lasers:
Diamond heat sinks applied in semiconductor lasers can significantly improve thermal dissipation efficiency. For example, high-quality CVD diamond heat sinks produced by Haiguang Intelligent Technology using advanced MPCVD technology achieved a temperature reduction of approximately 25°C in semiconductor lasers while increasing power output by 15%. Furthermore, the use of diamond heat sinks in IGBT modules has significantly reduced thermal resistance and extended module lifespan by 30%.
3. Heat Dissipation Applications of Diamond Materials in 5G Communications:
In the 5G communications sector, diamond heat sinks provide exceptional heat dissipation for high-frequency, high-power RF devices, thereby enhancing system reliability. Furthermore, diamond materials are also applied in the new energy vehicle sector, where they reduce thermal runaway phenomena, thereby extending battery range and enhancing safety.
4. Applications of Diamond Materials in High-Power Devices:
Diamond materials are referred to as the fourth-generation heat dissipation material and play a crucial role in cooling critical components such as high-power electronic devices and semiconductor chips. For example, large-size, high-quality diamond films produced by Compound Electronics using microwave plasma chemical vapor deposition (MPCVD) are used as heat sink materials in semiconductor lasers. By depositing a metallization layer on the surface of CVD diamond heat sink plates via a magnetron sputtering system, heat dissipation efficiency is significantly improved.
These examples demonstrate the wide-ranging applications and significant effectiveness of polycrystalline diamond materials in heat dissipation. As technology continues to advance, the use of polycrystalline diamond materials in heat dissipation will become even more widespread.
