Recently, a domestic superhard material enterprise has made new progress in the industrialization of CVD diamond heat sink. Thermal-grade CVD diamond heat sinks of multiple specifications have been delivered in batches. The thermal conductivity of the product reaches 1800–2200 W/m・K, providing a domestic high-end thermal management solution for AI computing chips, RF devices, high-power lasers and silicon carbide power modules.
CVD heat sink is fabricated via the MPCVD chemical vapor deposition process. Carbon atoms are orderly deposited and grown in a vacuum plasma environment. Compared with traditional heat-conducting materials such as copper and aluminum, its thermal conductivity is 4–5 times that of pure copper. Meanwhile, it features good insulation, a low coefficient of thermal expansion and excellent high-temperature stability. It can quickly dissipate local hot spots of chips, reduce the peak temperature of devices, and mitigate issues including frequency derating, warpage and failure caused by overheating. It is recognized as a top-tier heat spreading material in the advanced electronics industry.
With the rapid development of AI servers, high-speed optical communication, automotive power semiconductors and industrial lasers, the heat flux density of chips keeps rising, and traditional heat dissipation materials are approaching their physical limits. High-end diamond heat sink has long relied on imports. The newly mass-produced products are available in square slices and round wafers. Single-sided/double-sided polishing and precision cutting customization are supported, with adjustable thickness and dimensions. The products have entered verification and supply phases for multiple semiconductor packaging and laser enterprises, effectively filling gaps in the domestic supply chain of high-end heat dissipation materials.
Industry insiders state that CVD diamond heat sink is a core product for superhard materials to extend into the semiconductor thermal management track amid the development of new productive forces. Going forward, with continuous optimization of large-size wafer processes and yield improvement, domestic CVD heat sinks will further lower application costs and help secure the independence and controllability of China’s high-power electronic industry chain.
