News-Henan JCB Superhard Material Co., Ltd

News

Position: Home > News

News

Passive Thermal Management Materials

Passive Thermal Management Materials

Passive cooling primarily employs thermal conduction or thermal radiat···

World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology

World's First! NVIDIA H200 Servers Delivered with Diamond Cooling Technology

With the rapid advancement of high-performance computing, high-power e···

The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads

The “Savior” for AI Chip Heat Dissipation: Graphene Thermal Pads

In today's era of rapid technological advancement, AI chips—the co···

The Unavoidable Heat Dissipation Challenge in Virtual Reality Development

The Unavoidable Heat Dissipation Challenge in Virtual Reality Development

Thermal Interface MaterialsTo effectively conduct heat, thermal interf···

Different preparation processes for diamond-coated copper cater to different requirements.

Different preparation processes for diamond-coated copper cater to different requirements.

Preparation methods significantly influence the thermophysical propert···

Breaking Through Diamond Heat Dissipation Challenges: Core Temperature Reduced by 23°C, Technology Scalable for AI Chips and Other Fields

Breaking Through Diamond Heat Dissipation Challenges: Core Temperature Reduced by 23°C, Technology Scalable for AI Chips and Other Fields

A university research team has developed a scalable diamond heat dissi···

Diamond Copper: The “Heat Dissipation Engine” Ushering in a New Era of Computing Power

Diamond Copper: The “Heat Dissipation Engine” Ushering in a New Era of Computing Power

As the hardest substance in nature, diamond also boasts exceptionally ···

Spherical Alumina: The Hardcore Performer in Thermal Conductive Fillers

Spherical Alumina: The Hardcore Performer in Thermal Conductive Fillers

With the growing demand for high thermal conductivity materials, fille···

Diamond Fillers: The “Hard Currency” of Heat Dissipation

Diamond Fillers: The “Hard Currency” of Heat Dissipation

Currently, diamond is primarily incorporated into thermal interface ma···

Key Advances in Thermal Management for High-Performance AI Chip Packaging

Key Advances in Thermal Management for High-Performance AI Chip Packaging

With the rapid advancement of electronic devices toward miniaturizatio···

Contact

+8616697772369/+8616697772169

info@jcbdiamond.com

wechat

16697772369/16697772169

5-1-22-2201, No. 42, Qingcui South Road, Guancheng District, Zhengzhou

Product list

Monocrystal Superhard Material

Polycrystalline Superhard Materials

Lab Grown Diamond

See all Product

Navigation

Message

Copyright © 2013 Henan JCB Superhard Material Co., Ltd 51统计入口

Email: info@jcbdiamond.com

微信二维码