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Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader
Polycrystalline diamond heat spreader

Polycrystalline diamond heat spreader

Diamond exhibits a combination of high thermal conductivity and electrical insulation properties. This substrate is positioned between the heat-generating component and the heat sink: the substrate rapidly distributes thermal energy across a larger surface area, thereby mitigating localized thermal hotspots. Unlike a conventional heat sink, it does not replace the radiator but rather functions as an effective thermal distribution layer.

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Thermal management substrates fabricated from polycrystalline diamond obtained via chemical vapor deposition (CVD), manufactured by our company, represent an ideal material for electronic heat dissipation applications. At ambient temperature, the thermal conductivity of CVD polycrystalline diamond exceeds that of copper by a factor of five. This material is suitable for a broad spectrum of thermotechnical applications and is extensively utilized in the fabrication of thermal management substrates for laser diodes, high-power semiconductor devices, microwave (RF) devices, and large-scale integrated circuits.

The thermal conductivity of polycrystalline CVD diamond thermal management substrates produced by our company can reach 1000–2000 W/m·K. The substrates are available with single-sided or double-sided polishing.



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