Thanks to its outstanding performance, diamond/copper composite sheets are being widely used in fields with extremely high heat dissipation requirements:
Computing chips and data centers: as heat spreaders or heat sinks for AI chips, CPUs, GPUs, and other computing chips. In scenarios such as national supercomputing centers, the application of this material can increase the heat transfer capability of chip modules by 80%, boost performance by 10%, and reduce temperature by 5°C.
5G communications and optical modules: to solve heat dissipation challenges in high‑power‑density devices such as 5G base stations.
Power electronics: used for efficient heat dissipation in new energy vehicle battery, electric drive, and electronic control systems, as well as in second‑generation (GaAs) and third‑generation (GaN) semiconductor devices.
Military and aerospace: used for heat dissipation in phased‑array systems such as airborne and shipborne radars.
In summary, diamond/copper composite sheets are an ideal material for addressing current and future heat dissipation challenges in high‑power electronic devices, and are becoming a critical link in ensuring the development of industries such as computing power, 5G communications, and new energy vehicles.
